某知名外资企业
PE
工程
工程
苏州
经验不限
本科
¥20 - 25K14薪
职位描述
Process(bonding)Engineer
Position Description
1.Responsible for the project management of bonding process introduction,match different bonding solutions according to customer requirements
2.Review the bonding design with R&D, share the solutions related to bonding
3.Follow up NPI schedule to build sample products and collect feedback from all concerned
4.Design/order/install /Validation tooling where needed for production,provide estimates on effort, cost,and lead times
5. Draft process documents for bonding process and training to (train the trainer)production
operators.
6. Bonding process optimization, while provicling operability, reducing costs, and improving yield.have knowledge of automation equipment
7.Skilled in analyzing bonding issues and related RA test issues.Analyze and solve problems from the perspectives of design structure,adhesive,and process
8.Other tasks assigned by the team leader.
Education:
.Bachelor's degree or above
.Major in electrical,optical,or mechanical engineering Experience:
.Relevant experience (>5Y)of OCA/OCR Processing industry
Competencles:
.Being process engineer of LCD PI coating,ODF or OCR bonding process.Knowledge and experience of Glue (silicone/acrylic acid),Optical Bonding.Good communication skills
.Good English abilities in written, spoken as a better, but not necessary.
.Analytical thinking and data driven with self-initiatives&Positive working attitude.
.Work experience of large LCD company(BOE,Tianma,Innolux,LG.)or Bonding Company is preferred
Experience of new devices and new process introduction is a plus Automated production line introduction experience is a plus.