A world-renowned semiconductor company
Your Role
Key responsibilities in this position
Play a key role in refining non‑standard packaging workflows, partnering closely with cross‑functional teams, and supporting the fast scale‑up and launch of AI‑related products.
Formulate and implement strategic initiatives to drive operational excellence across OSAT activities.
Lead the creation and execution of operational roadmaps for Outsourced Semiconductor Assembly and Test (OSAT), focusing on critical KPIs such as yield, quality, and overall equipment effectiveness (OEE).
Work collaboratively with cross‑disciplinary teams to enable AI product development and successful market introduction.
Provide technical direction and mentorship to ensure smooth product ramp‑up and continuous improvement throughout high‑volume manufacturing.
Your Profile
Qualifications and skills that will help you thrive
Over 10 years of experience in backend assembly processes and test engineering, with strong quality discipline in semiconductor backend or substrate manufacturing environments.
Deep understanding and persistence in production sustaining, process development/optimization, and yield enhancement.
Strong analytical capability and problem‑solving mindset, with intermediate to advanced proficiency in tools such as Spotfire, JMP, or similar platforms.
Solid knowledge of VDA 6.3, IATF16949, APQP, FMEA, DOE, SPC, 8D, and other quality methodologies.
Effective communication skills and the ability to work in a cross‑functional setting, delivering hands‑on results while balancing win‑win outcomes.
Experience in managing external manufacturing partners, with the ability to drive OSAT performance and ensure timely execution under tight schedules.
Fast learner with curiosity and a continuous‑improvement mindset, always seeking new challenges and opportunities to enhance processes.
Willingness to travel frequently for on‑site support (more than 70% annually).
Experience with chip‑embedded packaging is an advantage.
Bachelor’s degree or above in Electronic Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, or related fields preferred.